Skill diminta
AuditingDeliveryTroubleshooting
Deskripsi
Job description
- Lead the Semi-Conductor PCBA Backend operations after SMT, covering Production, Process Engineering, Test, QA, inspection, rework, assembly, and packing.
- Ensure safety, output, quality, delivery, cost, and productivity targets are achieved.
- Plan and control manpower, capacity, equipment readiness, shift requirements, and daily priorities.
- Monitor output, yield, defect rate, downtime, rework, scrap, and on-time delivery performance.
- Lead daily operational reviews and coordinate actions across Production, Process, Test, QA, Planning, Engineering, and Supply Chain.
- Drive troubleshooting, root-cause analysis, corrective action, yield improvement, and continuous improvement.
- Support NPI, process validation, equipment qualification, test readiness, and production ramp-up.
- Ensure work instructions, process parameters, test controls, inspection requirements, and traceability are properly implemented.
- Ensure compliance with customer, quality-system, audit, and safety requirements.
- Report operational performance, risks, escalations, and recovery plans to management.
Requirements
- Strong experience in electronics, PCBA, semiconductor, or high-mix manufacturing operations.
- Good understanding of backend manufacturing processes after SMT, including manual assembly, soldering, inspection, testing, rework, higher assembly, and packing.
- Previous experience managing multidisciplinary teams covering Production, Process Engineering, Test, and Quality.
- Able to work closely with customers, management, and cross-functional departments.
- 8+ years in electronics/semiconductor manufacturing, including at least 3+ years in management.
- Strong Lean, root-cause analysis, corrective action, and continuous improvement skills.
- Minimum Diploma in Electronics, Electrical, Mechatronics, Industrial Engineering, or related technical field.